Troubleshooting Adhesion Problems in Tablets with High API Loads
Tablets with high active pharmaceutical ingredient (API) loads present unique challenges during the manufacturing process, particularly when it comes to adhesion problems. Adhesion refers to the ability of a tablet’s components, such as the powder blend and excipients, to stick together during the compression process. Tablets with high API loads are more prone to adhesion issues due to the greater density and hardness of the tablet matrix, which can cause excessive friction and inadequate bonding between ingredients. Adhesion problems can lead to issues such as poor tablet integrity, capping, lamination, or sticking to punches and dies during compression.
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